Laser Degluing Equipment
Product classification:Sem <≈'i-conductor
Function Overview:
====【Application】
This equipment "σis used for adh©→≈esive residue by laser&nb₩>sp;for semiconductor product ε₹;pin after packaging.
product details
==== 【Functions and Features】
1.Laser technology combined wi>§πth visual positioning,λ×↑φ which can achieve 0~0.1MM the minimum dist"↔ε₩ance from the edge o®§πf the pin without residual ₹adhesive;
3.The adhesive remova±↑l path (width & shape) can be set, saved, ca λ¥>lled and updated according to prod ♣∑♣uct requirements;
4.TT≤1.44S；
5.The adhesivβαe residue removal depth i≥<'×s managed by adjusting the laser band and φ★energy; Different product models±↑&& can be switched only by calling parameters.