High-precision Chip Transporting Equip֦ment
Product classificati∑↕♦δon:Semi-conductor
Function Overview:
====【Application】
This device is used&★ ✘nbsp;for handliΩ←δng&transferring c™↔ hips from a waffle&nbs₩φp;pack to a visua≥"&δl inspection fixture or a&n₹₹↔bsp;wire binding fixturγ<★e in the production&nbδσλγsp;of chips in the se©→✘§miconductor field.
product details
==== 【Functions and Features】
1. X/Y axes equipped with hi∏✘gh-precision linear motor and vis♦∑ ual positioning;
2.Gantry structure is made of marble ₩↑&and stainless steel, which is <↑ designed for the stable running of the mecha☆§>nism;
3.Accuracy: ±↓;15UM, Yield: ≥99.8±<%, TT≤2S；
4.Customized V-shaped automatic guide vλ≥πisual inspection fixture↑≠φ simplifies and quickens the pack '©£cover removal.